THERM PAD SIP PKG W/ADH HI-FLOW

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Product Information

Category	Fans, Thermal Management
Adhesive	Adhesive - One Side
Material	Phase Change Compound
Thermal Conductivity	0.8 W/m-K
Family	Thermal - Pads, Sheets
Product Photos	HF115AC-0.0055-AC-105
Standard Package	100
Color	Gray
Series	Hi-Flow 115-AC
Thermal Resistivity	0.35 C/W
Datasheets	Hi-Flow 115-AC
Catalog Drawings	SIP_105
Thickness	0.0055" (0.140mm)
Shape	Rectangle
RoHS Information	Hi-Flow 115-AC Material Report
Backing, Carrier	Fiberglass
Usage	SIP
Other Related Documents	Sil-Pad Metric Configurations
Other Names	BER170 HF115AC-105 HF115AC00055AC105 HF115TAAC-105
Outline	36.83mm x 21.29mm

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