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CONN IC DIP SOCKET 12POS GOLD

Part No.:
MS05
Manufacturer:
Apex Microtechnology
MS05

Product Information

CategoryConnectors, Interconnects
Contact Resistance-
Current Rating-
Housing MaterialPolyester, Glass Filled
Operating Temperature-
Number of Positions or Pins (Grid)12 (2 x 6)
Contact Finish Thickness - Post200 in (5.08 m)
Contact Material - MatingBeryllium Copper
TypeDIP, 1.2" (30.48mm) Row Spacing
Contact Finish - MatingGold
Product PhotosMS05
Product Training ModulesPower Analog Portfolio
DatasheetsMS05
Standard Package1
Contact Material - PostBrass
FamilySockets for ICs, Transistors
Material Flammability RatingUL94 V-0
TerminationSolder
Pitch - Mating0.100" (2.54mm)
FeaturesOpen Frame
Mounting TypeThrough Hole
Termination Post Length0.270" (6.86mm)
SeriesApex Precision Power
PackagingBulk
Contact Finish Thickness - Mating30 in (0.76 m)
Contact Finish - PostTin
Other Names598-1386 598-2041 598-2041-ND
Pitch - Post0.100" (2.54mm)


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