128K X 40 MULTI DEVICE SRAM MODULE, 30 ns, CQFP200

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Product Information

Terminal Pitch	0.9000 mm
Terminal Form	FLAT
Operating Temperature-Max	125 Cel
Number of Words Code	128K
Supply Voltage-Nom (Vsup)	5 V
Temperature Grade	MILITARY
Package Shape	SQUARE
Status	ACTIVE
Operating Temperature-Min	-55 Cel
Number of Words	131072 words
Package Body Material	CERAMIC, METAL-SEALED COFIRED
Number of Functions	1
Access Time-Max (tACC)	30 ns
Memory Density	5.24E6 deg
Supply Voltage-Max (Vsup)	5.5 V
Supply Voltage-Min (Vsup)	4.5 V
Organization	128K X 40
Memory Width	40
Surface Mount	Yes
Parallel/Serial	PARALLEL
Mfr Package Description	2.100 X 2.100 INCH, CERAMIC, QFP-200
Operating Mode	ASYNCHRONOUS
Number of Terminals	200
Terminal Position	QUAD
Technology	CMOS
Package Style	FLATPACK, GUARD RING
Memory IC Type	MULTI DEVICE SRAM MODULE

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