CONN IC DIP SOCKET 16POS GOLD

The actual product may differ from image shown

Product Information

Category	Connectors, Interconnects
Contact Resistance	10 mOhm
Current Rating	-
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature	-55 C ~ 105 C
Number of Positions or Pins (Grid)	16 (2 x 8)
Contact Finish Thickness - Post	Flash
Contact Material - Mating	Beryllium Copper
Type	DIP, 0.3" (7.62mm) Row Spacing
Contact Finish - Mating	Gold
Product Photos	816-AG11D-ESL-LF
Datasheets	1571552 Drawing
Standard Package	30
Contact Material - Post	Copper
Family	Sockets for ICs, Transistors
Material Flammability Rating	UL94 V-0
RoHS Information	2-1571552-4 Statement of Compliance RoHS 2 Statement
Termination	Solder
Pitch - Mating	0.100" (2.54mm)
Online Catalog	800 Series
Features	Open Frame
Mounting Type	Through Hole
Termination Post Length	0.125" (3.18mm)
Series	800
Packaging	Tube
Contact Finish Thickness - Mating	Flash
3D Model	2-1571552-4.pdf
Contact Finish - Post	Gold
Other Names	2-1571552-4 2-1571552-4-ND A121455
Pitch - Post	0.100" (2.54mm)

Offer your acceptable price, and we may make you satisfied.Your Target Price