CONN IC DIP SOCKET 16POS TIN

The actual product may differ from image shown

Product Information

Category	Connectors, Interconnects
Contact Resistance	30 mOhm
Current Rating	-
Housing Material	Thermoplastic, Glass Filled
Operating Temperature	-55 C ~ 105 C
Number of Positions or Pins (Grid)	16 (2 x 8)
Contact Finish Thickness - Post	-
Contact Material - Mating	Beryllium Copper
Type	DIP, 0.6" (15.24mm) Row Spacing
Contact Finish - Mating	Tin
Product Photos	2-382712-1
Datasheets	382712 Drawing
Standard Package	26
Contact Material - Post	Beryllium Copper
Family	Sockets for ICs, Transistors
Material Flammability Rating	UL94 V-0
PCN Obsolescence/ EOL	Socket product 01/Jul/2014
Termination	Solder
Pitch - Mating	0.100" (2.54mm)
Features	Open Frame
Mounting Type	Through Hole
Termination Post Length	0.128" (3.24mm)
Series	Diplomate DL
Packaging	Tube
Contact Finish Thickness - Mating	-
Contact Finish - Post	Tin
Other Names	A118692
Pitch - Post	0.100" (2.54mm)

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