CONN IC DIP SOCKET 16POS GOLD

The actual product may differ from image shown

Product Information

Category	Connectors, Interconnects
Contact Resistance	30 mOhm
Current Rating	-
Catalog Drawings	Dual Leaf Socket 16-Position Dual Leaf Socket Cutaway Dual Leaf Socket Side
Housing Material	Thermoplastic, Glass Filled
Operating Temperature	-55 C ~ 125 C
Number of Positions or Pins (Grid)	16 (2 x 8)
Contact Finish Thickness - Post	30 in (0.76 m)
Contact Material - Mating	Beryllium Copper
Type	DIP, 0.3" (7.62mm) Row Spacing
Contact Finish - Mating	Gold
Product Photos	1-1825094-4
Datasheets	1825094 Drawing
Standard Package	2,600
Contact Material - Post	Beryllium Copper
Family	Sockets for ICs, Transistors
Material Flammability Rating	UL94 V-0
RoHS Information	1-1825094-4 Statement of Compliance RoHS 2 Statement
Termination	Solder
Pitch - Mating	0.100" (2.54mm)
Features	Closed Frame
Mounting Type	Through Hole
Termination Post Length	0.128" (3.24mm)
Series	Diplomate DL
Packaging	Tube
Contact Finish Thickness - Mating	30 in (0.76 m)
Contact Finish - Post	Gold
Other Names	A32880
Pitch - Post	0.100" (2.54mm)

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